SK hynix ships 48 GB HBM4E samples, narrowing Samsung’s AI memory lead
SK hynix has delivered 12‑stack HBM4E samples featuring 48 GB capacity and 16 Gbps per pin speeds to major AI customers. The chips promise over 20% power‑efficiency gains and a 17% heat‑resistance improvement, positioning the company to challenge Samsung in next‑gen AI memory.