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AI · technologyreview.com · Friday, 18 September 2026

AI infrastructure is pushing materials to new heat and power limits

AI infrastructure builders are running into material limits around performance, heat, electrical efficiency, and reliability, so the next gains depend on more than chips and algorithms. Syensqo is developing high-voltage data-center materials, semiconductor seals, and direct-immersion cooling fluids, while using AI agents to screen millions of molecular combinations before lab testing. The company says this can widen and speed discovery while weighing sustainability from the start.

Read the source: technologyreview.com ↗In the 18 September issue →